
A-833
0 VOC 100% -solids, 2 part epoxy. Excellent for metal to metal and other rigid materials such as glass, plastics, wood, and structural laminates. Paste form is easy to apply and resistant to drip. Bonds Teflon to anodized aluminum. Used in the manufacture of aluminum propeller blade shanks.
Lap Shear
(psi)
Dielectric
(Volts/Mil@ RT)
Resistant
Curing
Parts
1500+
1200+
Hydraulic Fluids
Environmental Condt
Salt Spray
Heat
2

A-62
Durable and structural bonds for metal to metal. Meets military specification MMM-A-134 Type 1. Excellent resistance to Alcohol, Hydraulic Fluids and other aerospace fluids and has been used extensively and specified for aerospace structural bonds.
Lap Shear
(psi)
Shelf Life
Curing
Parts
2500
12 months
Room Temperature
2

A-643
Adelphi A643 is a one part, heat cure adhesive designed for high temperature following applications : 1. Motor laminates 2. Transform cores. It formulated with exceptionally low hydrolysable chloride for exceptional chemical resistance to aggressive solvents and concentrated acids.
Lap Shear
(psi)
Viscosity
(cps)
Resistant
Curing
Parts
4500
1200+
Chemical Resistant
Acid Resistant
Heat
1

A-971
Adelphi A971 is a high-strength, room-temperature-curing, 100%-Reactive, two-component, formulated epoxy adhesive. This adhesive cures at room temperature, making it perfect for use of NdFeB mangets with low Curie temperatrues. Designed for bonding all metals and other rigid materials (such as glass, ceramics, plastics, plastic foams and structural laminates) to themselves and to each other.
Lap Shear
(psi)
Viscosity
(cps)
Resistant
Curing
Parts
2500
Medium Syrup
Weather, Galvanic action and most chemical, Acids and alkalis.
Room Temperature
2

A-64
It can be used for bonding all metals, hard plastics, treated Teflon, and olefin plastics to themselves or to dissimilar materials. This adhesive cures at room temperature, making it perfect for use of NdFeB magnets with low Curie temperatures. A special application of this adhesive is as a terminal sealer where the thixotropy of the adhesive is essential to successful spot bonding of the wires to the terminal. A-64 is recommended for any application where the flow of the adhesive during cure cannot be tolerated.
Tensile Shear
(psi)
Viscosity
(cps)
Resistant
Curing
Parts
2311
Thixatropic
Low out-gassing Moderate thermal changes
Room Temperature
2
Electronics Assembly
Adelphi Materials manufactures a wide range of products designed for electronic assembly. Our products are tested and proven to work for numerous applications. We offer a wide range of materials that vary in viscosity, conductivity and cure time. Call us with your requirments.
Highlights
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Our glob tops and dam & fill epoxies offer excellent thermal cycling resistance
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Potting compounds with high Tg and a low CTE are suitable for the most demanding applications
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Encapsulants and Potting compounds with superior heat dissipation and electrical insulation
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Viscosities are easily varied from thixotropic, to VPI and trickle
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High temperature resistance up to 3200F
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Excellent chemical resistance
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UV Cure protective coatings
Uses
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UV Curable Protective coatings
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Conformal Coating
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Underfill Coating
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Sensor Adhesives
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Potting Compounds
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Encapsulants

