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A-833

0 VOC 100% -solids, 2 part epoxy. Excellent for metal to metal and other rigid materials such as glass, plastics, wood, and structural laminates. Paste form is easy to apply and resistant to drip. Bonds Teflon to anodized aluminum. Used in the manufacture of aluminum propeller blade shanks.

Lap Shear

(psi)

Dielectric

(Volts/Mil@ RT)

Resistant

​

Curing

Parts

1500+

1200+

Hydraulic Fluids
Environmental Condt
Salt Spray ​

Heat

2

A-62

Durable and structural bonds for metal to metal. Meets military specification MMM-A-134 Type 1. Excellent resistance to Alcohol, Hydraulic Fluids and other aerospace fluids and has been used extensively and specified for aerospace structural bonds.

Lap Shear

(psi)

Shelf Life

​

Curing

​

Parts

​

2500

12 months

Room Temperature

2

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A-643

Adelphi A643 is a one part, heat cure adhesive designed for high temperature following applications : 1. Motor laminates 2. Transform cores. It formulated with exceptionally low hydrolysable chloride for exceptional chemical resistance to aggressive solvents and concentrated acids.

Lap Shear

(psi)

Viscosity

(cps)

Resistant

​

Curing

Parts

4500

1200+

Chemical Resistant
Acid Resistant

Heat

1

A-971

Adelphi A971 is a high-strength, room-temperature-curing, 100%-Reactive, two-component, formulated epoxy adhesive. This adhesive cures at room temperature, making it perfect for use of NdFeB mangets with low Curie temperatrues. Designed for bonding all metals and other rigid materials (such as glass, ceramics, plastics, plastic foams and structural laminates) to themselves and to each other.

Lap Shear

(psi)

Viscosity

(cps)

Resistant

​

Curing

Parts

2500

Medium Syrup

Weather, Galvanic action and most chemical, Acids and alkalis.

Room Temperature

2

A-64

It can be used for bonding all metals, hard plastics, treated Teflon, and olefin plastics to themselves or to dissimilar materials. This adhesive cures at room temperature, making it perfect for use of NdFeB magnets with low Curie temperatures. A special application of this adhesive is as a terminal sealer where the thixotropy of the adhesive is essential to successful spot bonding of the wires to the terminal. A-64 is recommended for any application where the flow of the adhesive during cure cannot be tolerated.

Tensile Shear

(psi)

Viscosity

(cps)

Resistant

​

Curing

Parts

2311

Thixatropic

Low out-gassing Moderate thermal changes

Room Temperature

2

Electronics Assembly

Adelphi Materials manufactures a wide range of products designed for electronic assembly. Our products are tested and proven to work for numerous applications. We offer a wide range of materials that vary in viscosity, conductivity and cure time. Call us with your requirments.

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Highlights​

  • Our glob tops and dam & fill epoxies offer excellent thermal cycling resistance

  • Potting compounds with high Tg and a low CTE are suitable for the most demanding applications 

  • Encapsulants and Potting compounds with superior heat dissipation and electrical insulation

  • Viscosities are easily varied from thixotropic, to VPI and trickle

  • High temperature resistance up to 3200F

  • Excellent chemical resistance

  • UV Cure protective coatings

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Uses

  • UV Curable Protective coatings

  • Conformal Coating​

  • Underfill Coating

  • Sensor Adhesives

  • Potting Compounds

  • Encapsulants

PCB-Conformal-coatings_edited.jpg

Conformal Coatings

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